Hermetic Packaging Market by Configuration (Multilayer Ceramic Packages, Pressed Ceramic Packages and Metal Can Packages), Type, Application, End User and Geography - Global Industry Analysis, Opportunities and Forecast up to 2026

The global hermetic packaging market size was valued at $3.36 billion in 2020, and is projected to reach $5.40 billion by 2026, growing at a CAGR of 8.2% during the forecast period.

• The demand in hermetic packaging market has thrived on the back of increasing use of hermetic packaging for preserving highly delicate electronic elements and rising demand from end-user industries.

• Additionally, increasing need to protect highly sensitive electronic components, increasing automotive sales in Asia Pacific, development in the North America healthcare sector, and growth in the electronics sector in Asia Pacific are the major factors propelling the market growth.
 
• However, high costs associated with hermetic packaging and presences of substitute technologies are restraining the market growth.

• Furthermore, the adoption of hermetic packaging for the protection of implantable medical devices creating lucrative growth opportunities for the hermetic packaging market.

Hermetic packaging is a modern level packaging system which has its primary applications in active and passive electronic devices and in semiconductor and electronics industry. It is a process of packaging products in a way that there will be no space for oxygen, chemicals and air to interfere with the product. This packaging methodis widely used in numerous applications such as architectural structures, aeronautics, and food & beverages.

By Type, Reed Glass Segment is Estimated to have a Lucrative Growth

This is mainly attributed to their highly reliable encapsulation of reed switches over millions of switching cycles. It has applications in the centralized locking systems of automobiles, as switches in hot water boilers or as belt sensors. These reed switches without any influence from the outside, opens and closes the electrical circuits, its because as they possess no mechanical control, they can handle millions of make-and-break cycles without any wear.

By Region, Asia-Pacific Dominates the Global Market Place

Asia-Pacific region is holding a significant market share in the global market place and is expected to remain dominant in the forecast period as well. This is mainly due to increasing automotive production together with high demand for technologically progressed passenger cars and automobiles is expected to promote the utilization of hermetic packaging. In Asia pacific region China is leading in the hermetic packaging market followed by Japan, South Korea, Taiwan and India. Rising energy requirement backed by high GDP growth rates in developing countries like China and India are generating opportunities for manufacturers of hermetically packaged components in the Asia Pacific Region.

List of the Key Players Profiled in the Market Include:
• Schott AG
• Ametek Inc.
• Amkor Technology
• EGIDE Group
• Kyocera Corporation
• Legacy Technologies, Inc.
• Materion Corporation
• Micross Components Inc.
• Renesas Electronics Corporation
• SGA Technologies Ltd.
• Special Hermetic Products, Inc.
• Teledyne Technologies Incorporated
• Texas Instruments Incorporated
• Willow Technologies Ltd.
• Winchester Interconnect

What Can be Explored with this Research Report:
• Understand the key trends that will drive the market, challenges it faces in the current market scenario.
• Identify growth opportunities.
• Porter’s five force analysis.
• In-depth analysis of market segments, and regions/countries predicted to observed promising growth.
• Historical and forecast size of the market in terms of revenue (USD Million).
• Company profiling with key products and solution offerings, key financial information, SWOT analysis, and business strategies adopted.

Market Segmentation:

The research report includes in-depth coverage of the industry analysis with size, share, and forecast for the below segments:

Market by, Configuration:
• Multilayer Ceramic Packages
• Pressed Ceramic Packages
• Metal Can Packages

Market by, Type:
• Ceramic–Metal (CERTM) Sealing
• Transponder Glass
• Passivation Glass
• Glass–Metal Sealing (GTMS)
• Reed Glass

Market by, Application:
• Airbag Igniters
• Lasers
• MEMS Switches
• Oscillating Crystals
• Photodiodes
• Sensors
• Transistors

Market by, End User:
• Military & Defense
• Aeronautics and Space
• Automotive
• Medical
• Telecommunications
• Other End Users

Market by, Geography:
• North America
• Europe
• Asia Pacific
• South America
• Middle East & Africa

Table Of Content

1 Market Overview           
    1.1 Introduction       
    1.2 Research Objectives      
    1.3 Market Segmentation      
    1.4 Stakeholders       
    1.5 List of Acronyms       
             
2 Executive Summary           
             
3 Research Methodology          
    3.1 Identification of Data      
    3.2 Evaluation of Market Dynamics     
    3.3 Collaboration of Data      
    3.4 Verification and Analysis      
    3.5 Data Sources       
    3.6 Assumptions       
             
4 Market Dynamics           
    4.1 Market Drivers       
            4.1.1 Increasing need to protect highly sensitive electronic components
            4.1.2 Rising automotive sales in Asia Pacific
    4.2 Market Restraints       
            4.2.1 High costs associated with hermetic packaging
    4.3 Market Opportunities      
            4.3.1 The use of hermetic packaging to protect implanted medical devices is becoming more common
    4.4 Market Challenges       
            4.4.1 Emergence of quasi-hermetic packaging
    4.5 Impact of COVID-19 on Hermetic Packaging Market    
             
5 Porter's Five Force Analysis          
    5.1 Bargaining Power of Suppliers      
    5.2 Bargaining Power of Buyers      
    5.3 Threat of New Entrants      
    5.4 Threat of Substitutes      
    5.5 Competitive Rivalry in the Market     
             
6 Global Hermetic Packaging Market by, Configuration       
    6.1 Overview       
    6.2 Multilayer Ceramic Packages      
    6.3 Pressed Ceramic Packages      
    6.4 Metal Can Packages       
             
7 Global Hermetic Packaging Market by, Type        
    7.1 Overview       
    7.2 Ceramic–Metal (CERTM) Sealing     
    7.3 Transponder Glass       
    7.4 Passivation Glass       
    7.5 Glass–Metal Sealing (GTMS)      
    7.6 Reed Glass       
             
8 Global Hermetic Packaging Market by, Application        
    8.1 Overview       
    8.2 Airbag Igniters       
    8.3 Lasers        
    8.4 MEMS Switches       
    8.5 Oscillating Crystals       
    8.6 Photodiodes       
    8.7 Sensors        
    8.8 Transistors       
             
9 Global Hermetic Packaging Market by, End User        
    9.1 Overview       
    9.2 Military & Defense       
    9.3 Aeronautics and Space      
    9.4 Automotive       
    9.5 Medical        
    9.6 Telecommunications      
    9.7 Other End Users       
              
10 Global Hermetic Packaging Market by, Geography        
    10.1 Overview       
    10.2 North America       
    10.3 Europe        
    10.4 Asia Pacific       
    10.5 South America       
    10.6 Middle East & Africa      
              
11 Key Developments           
             
12 Company Profiling           
    12.1 Schott AG       
             12.1.1 Business Overview
             12.1.2 Product/Service Offering
             12.1.3 Financial Overview
             12.1.4 SWOT Analysis
             12.1.5 Key Activities
    12.2 Ametek Inc.       
    12.3 Amkor Technology       
    12.4 EGIDE Group       
    12.5 Kyocera Corporation      
    12.6 Legacy Technologies, Inc.      
    12.7 Materion Corporation      
    12.8 Micross Components Inc.      
    12.9 Renesas Electronics Corporation     
    12.10 SGA Technologies Ltd.      
    12.11 Special Hermetic Products, Inc.     
    12.12 Teledyne Technologies Incorporated     
    12.13 Texas Instruments Incorporated     
    12.14 Willow Technologies Ltd.      
    12.15 Winchester Interconnect